Going vertical with LETI: Solutions to new applications using 3D technologies
- Welcome - Leti's 3D integration for tomorrow's devices > M.N Semeria
- CoolCubeTM: 3D sequential integration to maintain Moore's Law > O. Faynot
- Photonics: why 3D integration is mandatory > H. Metras
- Computing: 3D technology for better performance > S. Cheramy
- Lighting: 3D integration for cost effectiveness > Y. C Robin
- Nanocharacterization for 3D > P. Bleuet
- Conclusion - Silicon Impulse > M.N Semeria
For more information: didier.louis@cea.fr
Come and visit Leti on European Pavilion
