Speeding innovation for industry
Article | Radio frequency | Micro-nanoelectronics
The Pictic large-area printing platform develops smart plastics, papers, and textiles produced by printing electronic functions directly on flexible, 320 mm x 380 mm surfaces. The applications for these flexible circuits are complementary to those addressed by silicon-based technologies, and include human-machine interfaces, smart lighting, interactive displays, and environmental monitoring.
The platform is Europe’s only specialized R&D facility to bring together all of the necessary printing techniques—screen printing, inkjet, gravure, flexography, and slot-die—under one roof. The platform also has characterization, assembly, encapsulation, and other equipment. The platform develops formulations for electronic inks, scales up printing processes for industrial rollout, and manufactures prototypes and test runs, working with corporations worldwide, as well as with startup Isorg. The processes developed at the platform stand out for their precision and competitive pricing. Electronic functions are deposited on the substrate in a single step, eliminating the need to use lithography and other subtractive processes.
> Access to: ALL TECHNOLOGY PLATFORMS
High-precision processes: alignment of electronics layers to within 10 microns; uniform deposition thicknesses
Slot-die printing, gravure, and flexography; sheet-fed printing
CEA Tech technology-platforms-booklet
How to collaborate with CEA Tech teams ?
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.