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Technological platforms

12 inches nanoelectronics platform

Published on 29 April 2016

HIGH-ADDED-VALUE MODULES AND INTERNATIONAL R&D PARTNERSHIPS

The 12 inches nanoelectronics platform develops advanced transistors, integrated circuits, and non-volatile memory. It is also where FD-SOI—today used to mass-produce chips worldwide—was born. The platform also conducts 3D integration R&D.
The platform’s scope covers simulation, technology development, demonstrators and prototyping, advanced characterization, and reliability testing. The platform can also conduct short-loop proof-of-concept testing with wafer manufacturing sites. Foundries, fabless manufacturers, integrators, and materials and equipment manufacturers that partner with the platform benefit from high-added-value modules offering excellent energy consumption, speed, and frequency—ideal for the microcontrollers used in the automotive and medical industries and for smart cards, for example. The platform is one of the world’s top five 300 mm nanoelectronics R&D centers, and counts fifteen strategic partnerships with organizations in the US and Europe. The platform is also home to advanced know-how in e-beam lithography, a potential alternative to optical lithography in achieving ultimate resolution.

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OUR Technologies

ALL TECHNOLOGIES


R&D AREAS

12" inches front-end modules and 3D integration

NOTABLE EQUIPMENT

100 heavy machines and instruments

KEY FIGURES

  • Open 24-7 
  • 3,300 sq. m of clean rooms
  • 200 research scientists and technicians
  • 70 patents filed per year
  • € 25 million annual investment

LOCATION

Leti (Grenoble) 

More information

CEA Tech technology-platforms-booklet



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