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Liste de actualités du Leti
Research engineers at CEA-Leti have developed an innovative superconducting interconnect brick that could enable achieving a higher density of chip-to-chip connections while minimizing the thermal transfer between the chips.
CEA-Leti startup iNGage is developing low-cost, high-performance, miniaturized Inertial Measurement Units. The company's innovative approach is the product of fifteen years' research in micro and nanoelectronics.
Designing ever smarter, more compact, and more advanced image sensors is a key challenge for the evolution of smartphones, connected objects, and artificial vision uses. It is precisely in the field of 3D integration that Stéphane Nicolas, project leader at CEA-Leti, distinguished himself. His innovative research, which was rewarded with the Outstanding Paper Award at the prestigious ECTC conference, opens new perspectives that will improve the architecture and increase the intelligence of sensors which are at the heart of our daily life.
A recently concluded 42-month EU project, ELENA, announced today the development of the first-ever, European-made lithium niobate on insulator (LNOI) substrates for photonic integrated circuits (PICs)—a breakthrough that establishes a fully European supply chain for thin-film lithium niobate (TFLN) technology.
CEA-Leti and Soitec today announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully depleted silicon-on-insulator (FD-SOI) technologies. This collaboration aims to position FD-SOI as a foundational platform for secure electronics by leveraging and extending its inherent resistance to physical attacks.
Applied Materials, Inc. and CEA-Leti today announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the organizations plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centers.
A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing industry today announced the launch of the GENESIS project. This integrated, large-scale initiative aims to enable Europe’s chip industry to meet its sustainability goals—from materials development to final waste treatment.
The FAMES Pilot Line today announced the official launch of the FAMES Academy, a strategic educational initiative designed to support the EU’s commitment to develop next-generation chips. The academy will be unveiled during CEA-Leti Innovation Days—LID World Summit, June 17-19, beginning with its inaugural workshop on June 18 in Grenoble.
The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will open its services to external customers in June 2025.
A research team from CEA-Leti and STMicroelectronics has made significant strides in advancing 3D integration technologies by optimizing the deposition of nanocrystalline copper (NC-Cu) for fine-pitch hybrid bonding applications.
CEA-Leti will present its latest research for the first time at the ECTC conference, through a paper concluding its work carried out within the European TINKER project. This EU-funded initiative aims to develop innovative manufacturing technologies for customized sensors, with a focus on autonomous vehicles.
CEA-Leti has pioneered a novel method for integrating molybdenum disulfide (MoS₂) onto 200 mm silicon wafers using molecular direct bonding. This innovative approach addresses challenges in the integration of 2D materials into standard semiconductor manufacturing processes.
Presentations Include Lab-to-Fab Developments, Intelligent Systems, And Collaborative Innovations Driving More-Sustainable Integrated Circuits
Presentation at Display Week Paves the Way Toward Displays That Show Content and Sense the Environment
Research engineers at CEA-Leti are redefining the future of display technology with next-generation multifunction displays that go far beyond classical displays. These displays are designed to interact with their environment, offering groundbreaking applications across various industries.
The development of hybrid bonding is a key factor for the future of the semiconductor industry. PhD student Mohammad Alsukour's research on this topic won the Best Paper award at 3DIC, an IEEE conference devoted to 3D systems integration. The results that he presented show some encouraging advances for the future of bonding technologies.
Clarivate has released its Top 100 Global Innovators 2025, recognizing organizations that demonstrate consistency and influence in innovation. This year, CEA ranks 30th globally, moving up one place from last year’s 31st position.
A key issue for national sovereignty, microfluidic technology now boasts a dedicated subsidiary in the Auvergne-Rhône-Alpes region. The initiative is driven by CEA-Leti and plasturgy company Infiplast, who are pooling their expertise to create a shared platform for the industrial scaling-up of microfluidic chips.
As the demand for smaller, more powerful chips continues to grow, researcher-engineers face new challenges in ensuring high performance and precision. One of the key innovations enabling this evolution is the backside power delivery network, a cutting-edge approach that optimizes space and efficiency by separating power and signal circuits across different layers of transistors.
CEA-Leti startup, nawu diagnostics, is developing a portable, autonomous solution to analyze pathogens in the air expelled by farm animals. The device offers rapid diagnostics of respiratory pathogens so that the appropriate treatment can be identified as quickly as possible, and thus prevent an epidemic.
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.